JPH0747904Y2 - 複合多層プリント配線基板 - Google Patents
複合多層プリント配線基板Info
- Publication number
- JPH0747904Y2 JPH0747904Y2 JP5636990U JP5636990U JPH0747904Y2 JP H0747904 Y2 JPH0747904 Y2 JP H0747904Y2 JP 5636990 U JP5636990 U JP 5636990U JP 5636990 U JP5636990 U JP 5636990U JP H0747904 Y2 JPH0747904 Y2 JP H0747904Y2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- composite multilayer
- multilayer printed
- perforations
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002131 composite material Substances 0.000 title claims description 13
- 239000000463 material Substances 0.000 claims description 39
- 239000004020 conductor Substances 0.000 claims description 18
- 238000005452 bending Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 7
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229960003280 cupric chloride Drugs 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5636990U JPH0747904Y2 (ja) | 1990-05-29 | 1990-05-29 | 複合多層プリント配線基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5636990U JPH0747904Y2 (ja) | 1990-05-29 | 1990-05-29 | 複合多層プリント配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0415266U JPH0415266U (en]) | 1992-02-06 |
| JPH0747904Y2 true JPH0747904Y2 (ja) | 1995-11-01 |
Family
ID=31580135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5636990U Expired - Lifetime JPH0747904Y2 (ja) | 1990-05-29 | 1990-05-29 | 複合多層プリント配線基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0747904Y2 (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7380681B2 (ja) * | 2019-04-26 | 2023-11-15 | Tdk株式会社 | 集合基板及びその製造方法 |
-
1990
- 1990-05-29 JP JP5636990U patent/JPH0747904Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0415266U (en]) | 1992-02-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |